Due to current demands in the construction sector, PUR PIR sandwich panels are considered the best basic choice for thermal insulation and safety. These sandwich panels are formed by an insulating core of rigid polyurethane or polyisocyanurate foam (PUR-PIR) adhered to two walls, which are usually metal. The metal layer is usually made of steel or aluminum. During the manufacturing process, the covering layer is prepared by molding into the required initial shape. Once molded as required for each type of panel, they are conveyed to the press, and the mixing head then injects the necessary components in a predetermined dose, thus forming a liquid phase foam. Its chemical reaction causes the foam to grow, adhering to the upper and lower covering layers. It is cured by heating and pressurizing for a certain time until it solidifies. The PUR PIR sandwich panels manufactured for safety reasons are then cut into predetermined lengths, stacked and packaged.
Difference between sandwich PUR and PIR boards
Rigid polyisocyanurate (PIR) foam is a variant of polyurethane (PUR) foam, whose appearance, mechanical and thermal properties remain virtually unchanged, the main difference being its better fire resistance. PIR foam safely catches fire by forming a charred surface layer that protects and prevents the fire from penetrating into the inner layers.
Due to their different chemical composition, sandwich panels offered by polyisocyanurate (PIR) differ from those using polyurethane (PUR) in their core physicochemical properties. Regarding their thermal properties, PIR is stable at temperatures between -200°C and 120°C, while PUR is thermally stable in the temperature range of -150°C to +80°C.
Parameter comparison of sandwich PUR PIR panels
|
Parameter |
Sandwich PUR panels |
Sandwich PUR panels |
|
Core material |
Polyether polyol, isocyanate, isocyanate index is about 110 - 120, generally need to add flame retardant |
Polyester polyol, isocyanate, isocyanate index above 250, no or less flame retardant |
|
Fire performance |
B2 Grade |
B1 Grade |
|
Thermal insulation performance |
Thermal conductivity 0.022 - 0.026W/mK(25℃) |
Thermal conductivity can be as low as 0.019W/mK(25℃) |
|
Water absorption |
2.5% - 3% |
0.9% |
|
Mechanical properties |
The overall mechanical strength is slightly weaker than that of PIR board |
Good mechanical strength, can give the product better high and low temperature dimensional stability and lower thermal decomposition rate |
|
Adhesive properties |
Relatively good adhesion to surface materials |
high brittle, and its bonding strength with the surface material is about 1/2 of that of PUR board. It also has a rapid secondary foaming characteristic, which affects the performance of the board surface. |
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